nScrypt, the company that produces high-precision microdisplays, has announced that they are able to print solder and adhesive dots in the 50-micron range using their new SmartPump conical pen tip. nScrypt is able to precisely control the volume of material deposited from its state-of-the-art microdisplay designed for electronics.
This achievement is expected to enhance the manufacturing of 3D-printed electronics and flexible hybrid electronics by allowing solder dots to be printed directly and precisely onto electronic boards.
Microdespensing is the 3D printing of pastes, inks, and other fluids in very small volumes, mostly in the picoliter or nanoliter range. This technology is similar to jet technology.
Microdispensing is crucial in digital manufacturing or the creation of 3D-printed electronics due to its very small print volumes and accuracy.
The nScrypt SmartPump can print over 10,000 commercially available materials, from water to peanut butter. This new microdispensing tool has a diameter of 10 microns, the smallest commercially available diameter on the market.
The microdispensing tool has the smallest commercially available diameter on the market, measuring in at 10 microns. The valve rod housed in its body is what sets it apart from other tool heads, allowing it to precisely control volumetric extrusion.
The nScrypt team set out with the goal of printing consistent and repeatable 50-micron Type IX solder and adhesive dots. The experiment resulted in an average dot diameter of 51.24 microns with a standard deviation of 6.42 microns, or 13%. The result is considered a success given the extremely small volumetric quantities being 3D printed.